28 in 1 Phone CPU BGA Chip Removal Repairing Silicon Manganese Alloy Blades Scraping Knife Set

  • 1. Silicon manganese alloy material blades, heat-resistant, cold-resistant, corrosion-resistant and durable
  • 2. For small vinyl chips removal
  • 3. For iPhone 6S power IC and glass IC removal
  • 4. For base band / CPU / WiFi modules removal
  • 5. For CPU upper layer deflation
Regular Price AUD15.98 Special Price AUD13.50
In stock
SKU
06-ETP3602
Features
  • 1. Silicon manganese alloy material blades, heat-resistant, cold-resistant, corrosion-resistant and durable
  • 2. For small vinyl chips removal
  • 3. For iPhone 6S power IC and glass IC removal
  • 4. For base band / CPU / WiFi modules removal
  • 5. For CPU upper layer deflation
  • 6. For glass IC removal
  • 7. For A4-A9 CPU and CPU upper layer removal
  • 8. For A8 A9 CPU removal
  • 9. For chips removal, oil scraping and tin scraping
  • 10. Tin scraping and base band scraping in one take
  • 11. Dilated tin scraping knife and CPU scraping in one take
  • 12. Blower gun temperature should be between 340 and 360 Celsius degree, wind speed should be 28-30
Specifications
General
Compatible withApple: iPhone XS, iPad 9.7 (2018), iPhone X, iPhone 8, iPhone 8 Plus, Watch Series 3 42mm, Watch Series 3 38mm, iPad Pro 12.9 inch (2017), iPad Pro 10.5 inch, iPad 9.7 inch (2017), iPhone 7, iPhone 7 Plus, Watch Series 2 38mm, Watch Series 2 42mmSamsung: Galaxy A7 (2018), Galaxy Note9, Galaxy J3 (2018), Galaxy A8 Star (A9 Star), Galaxy J8 (2018), Galaxy J7 (2018), Galaxy A6+ (2018), Galaxy A6 (2018), Galaxy J4 (2018), Galaxy J6 (2018), Galaxy S9, Galaxy J2 Pro (2018), Galaxy A8 (2018), Galaxy A8+ (2018)Huawei: P20 Pro, P20, Honor 9i, Y5 Prime (2018), Honor Play, Enjoy 8 Plus, Honor Play 7, Honor 10, Y9 (2018), Y6 (2018), Honor 7A, Honor 7C / Enjoy 8, P9 lite, P9Xiaomi: Redmi 6 Pro / MI A2 lite, Redmi 6A, Redmi 6, Mi 8 Explorer, Mi 8, Mi 8 SE, Redmi S2, Mi 6X / A2, Redmi Note 5, Redmi Y1 Lite, Mi Pad 3, Mi 5, Redmi Note 3, Redmi Note 2 Asus: ZenPad Z10 (ZT500KL) LG: Q Stylo 4, G7 ThinQ, V35 ThinQ, K8 (2018), K10 (2018), G6, K8, Stylus 2, G5 HTC: U12+, Desire 12+, Desire 12, U11 Eyes, U11 Life, U11+, Butterfly 3, One A9s, U11, One X10, Desire 10 Lifestyle, One S9, 10, One M8sSony: Xperia XZ2, Xperia XZ2 Premium, Xperia XZ2 Compact, Xperia X, Xperia Z5, Xperia Z5 Premium, Xperia M5, Xperia Z3 Nokia: 9, 5.1, 3.1, X6 (2018), 1, 8 Sirocco, 6.1 / 6 (2018) / 6 (2nd Gen), 7 Plus, 2, 8, 7, 5, 3, 6ONEPLUS: 6, 5T, 5 OPPO: Find X, Realme 1, A3, F7, A73 / F5 Youth Lenovo: Z5, S5, Tab 2 A8-50, K3 Note Motorola: Moto Z3 Play, Moto E5 Play, Moto G6, Moto G6 Plus, Moto E5 Plus, Moto E5, Moto Z2 Force Google: Pixel 2 XL, Pixel, Pixel XL BLUBOO: D6 UMIDIGI: A1 Pro
General
TypesHand Tools
MaterialMetal, Silicon Manganese Alloy
Length13.5cm (handle)
Weight22g (handle)
Packing List
  • 28 in 1 Phone CPU BGA Chip Removal Repairing Silicon Manganese Alloy Blades Scraping Knife Set
  • Original set and packaging
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