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28-in-1 Phone CPU BGA Chip Removal Repairing Knife Set with Silicon Manganese Alloy Blades

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SKU: 06-ETP3602

This set of blades is made of heat-resistant, cold-resistant, corrosion-resistant silicon manganese alloy material, ideal for small vinyl chips removal, iPhone 6S power IC and glass IC removal, base band/CPU/WiFi modules removal, CPU upper layer deflation, A4-A9 CPU and CPU upper layer removal, chips removal, oil scraping and tin scraping, tin scraping and base band scraping in one take, dilated tin scraping knife and CPU scraping in one take. Blower gun temperature should be between 340-360 Celsius with wind speed 28-30.

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$10.80

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Overview
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Features

1. Silicon manganese alloy material blades, heat-resistant, cold-resistant, corrosion-resistant and durable
2. For small vinyl chips removal
3. For iPhone 6S power IC and glass IC removal
4. For base band / CPU / WiFi modules removal
5. For CPU upper layer deflation
6. For glass IC removal
7. For A4-A9 CPU and CPU upper layer removal
8. For A8 A9 CPU removal
9. For chips removal, oil scraping and tin scraping
10. Tin scraping and base band scraping in one take
11. Dilated tin scraping knife and CPU scraping in one take
12. Blower gun temperature should be between 340 and 360 Celsius degree, wind speed should be 28-30

Specifications

General
Compatible with	Apple: iPhone XS, iPad 9.7 (2018), iPhone X, iPhone 8, iPhone 8 Plus, Watch Series 3 42mm, Watch Series 3 38mm, iPad Pro 12.9 inch (2017), iPad Pro 10.5 inch, iPad 9.7 inch (2017), iPhone 7, iPhone 7 Plus, Watch Series 2 38mm, Watch Series 2 42mmSamsung: Galaxy A7 (2018), Galaxy Note9, Galaxy J3 (2018), Galaxy A8 Star (A9 Star), Galaxy J8 (2018), Galaxy J7 (2018), Galaxy A6+ (2018), Galaxy A6 (2018), Galaxy J4 (2018), Galaxy J6 (2018), Galaxy S9, Galaxy J2 Pro (2018), Galaxy A8 (2018), Galaxy A8+ (2018)Huawei: P20 Pro, P20, Honor 9i, Y5 Prime (2018), Honor Play, Enjoy 8 Plus, Honor Play 7, Honor 10, Y9 (2018), Y6 (2018), Honor 7A, Honor 7C / Enjoy 8, P9 lite, P9, Mate 8, Ascend Mate7Xiaomi: Redmi 6 Pro / MI A2 lite, Redmi 6A, Redmi 6, Mi 8 Explorer, Mi 8, Mi 8 SE, Redmi S2, Mi 6X / A2, Redmi Note 5, Redmi Y1 Lite, Mi Pad 3, Mi 5, Redmi Note 3, Redmi Note 2 Asus: ZenPad Z10 (ZT500KL) LG: Q Stylo 4, G7 ThinQ, V35 ThinQ, K8 (2018), K10 (2018), G6, K8, Stylus 2, G5 HTC: U12+, Desire 12+, Desire 12, U11 Eyes, U11 Life, U11+, Butterfly 3, One A9s, U11, One X10, Desire 10 Lifestyle, One S9, 10, One M8s, One M9, Desire 816Sony: Xperia XZ2, Xperia XZ2 Premium, Xperia XZ2 Compact, Xperia X, Xperia Z5, Xperia Z5 Premium, Xperia M5, Xperia Z3 Nokia: 9, 5.1, 3.1, X6 (2018), 1, 8 Sirocco, 6.1 / 6 (2018) / 6 (2nd Gen), 7 Plus, 2, 8, 7, 5, 3, 6, Lumia 830, Lumia 530ONEPLUS: 6, 5T, 5 OPPO: Find X, Realme 1, A3, F7, A73 / F5 Youth Lenovo: Z5, S5, Tab 2 A8-50, K3 Note Motorola: Moto Z3 Play, Moto E5 Play, Moto G6, Moto G6 Plus, Moto E5 Plus, Moto E5, Moto Z2 Force Google: Pixel 2 XL, Pixel, Pixel XL BLUBOO: D6 UMIDIGI: A1 Pro
General
Types	Hand Tools
Material	Metal, Silicon Manganese Alloy
Length	13.5cm (handle)
Weight	22g (handle)

Packing List

28 in 1 Phone CPU BGA Chip Removal Repairing Silicon Manganese Alloy Blades Scraping Knife Set
Original set and packaging

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28-in-1 Phone CPU BGA Chip Removal Repairing Knife Set with Silicon Manganese Alloy Blades

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